電路板的材質是什么

印刷電路板的(de)(de)(de)(de)主要材料是覆(fu)銅(tong)(tong)(tong)板(ban)(ban)(ban)(ban)，而覆(fu)銅(tong)(tong)(tong)板(ban)(ban)(ban)(ban)（敷銅(tong)(tong)(tong)板(ban)(ban)(ban)(ban)）是由(you)基(ji)板(ban)(ban)(ban)(ban)、銅(tong)(tong)(tong)箔(bo)和粘(zhan)合劑構成的(de)(de)(de)(de)。基(ji)板(ban)(ban)(ban)(ban)是由(you)高分(fen)子合成樹脂和增強材料組成的(de)(de)(de)(de)絕緣(yuan)層板(ban)(ban)(ban)(ban)；在基(ji)板(ban)(ban)(ban)(ban)的(de)(de)(de)(de)表(biao)面(mian)覆(fu)蓋(gai)著一(yi)層導電率較高、焊接性良好的(de)(de)(de)(de)純銅(tong)(tong)(tong)箔(bo)，常(chang)(chang)用(yong)厚度35～50／ma；銅(tong)(tong)(tong)箔(bo)覆(fu)蓋(gai)在基(ji)板(ban)(ban)(ban)(ban)一(yi)面(mian)的(de)(de)(de)(de)覆(fu)銅(tong)(tong)(tong)板(ban)(ban)(ban)(ban)稱(cheng)(cheng)為單面(mian)覆(fu)銅(tong)(tong)(tong)板(ban)(ban)(ban)(ban)，基(ji)板(ban)(ban)(ban)(ban)的(de)(de)(de)(de)兩(liang)面(mian)均覆(fu)蓋(gai)銅(tong)(tong)(tong)箔(bo)的(de)(de)(de)(de)覆(fu)銅(tong)(tong)(tong)板(ban)(ban)(ban)(ban)稱(cheng)(cheng)雙面(mian)覆(fu)銅(tong)(tong)(tong)板(ban)(ban)(ban)(ban)；銅(tong)(tong)(tong)箔(bo)能否牢固地覆(fu)在基(ji)板(ban)(ban)(ban)(ban)上，則由(you)粘(zhan)合劑來完成。常(chang)(chang)用(yong)覆(fu)銅(tong)(tong)(tong)板(ban)(ban)(ban)(ban)的(de)(de)(de)(de)厚度有(you)1.0mm、1.5mm和2.0mm三(san)種。

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常用的覆銅板種類有哪些

覆銅板的種類(lei)也較多。按絕緣材(cai)料不同可分(fen)為(wei)紙(zhi)基(ji)板、玻璃布(bu)基(ji)板和合成纖維板；按粘結(jie)劑樹(shu)脂不同又分(fen)為(wei)酚醛、環氧、聚脂和聚四氟乙(yi)烯等；按用(yong)(yong)途(tu)可分(fen)為(wei)通用(yong)(yong)型(xing)和特殊型(xing)。

（1）覆銅箔酚醛紙(zhi)層壓板

是由絕緣(yuan)浸漬紙(zhi)（TFz一62）或棉纖維浸漬紙(zhi)（1TZ-一63）浸以(yi)酚醛樹脂(zhi)經熱(re)壓而成(cheng)的層壓制(zhi)品，兩(liang)表面膠紙(zhi)可附以(yi)單張無堿玻璃浸膠布，其一面敷以(yi)銅箔。主要用作無線(xian)電設備中(zhong)的印制(zhi)電路板。

（2）覆銅箔酚醛玻(bo)璃布層壓板

是用無堿玻璃布浸以環氧酚醛樹脂經熱壓而成的層壓制品，其一面或雙面敷以銅箔，具有質輕、電氣和機械性能良好、加工方便等優點。其板面呈淡黃色，若用三氰二胺作固化劑，則板面呈淡綠色，具有良好的透明度。主要在工作溫度和工作頻率較高的無線電設備中用作印制電路板。

（3）覆銅箔聚四氟(fu)乙(yi)烯層壓板

是以(yi)聚(ju)四氟乙(yi)烯板(ban)(ban)為基板(ban)(ban)，敷以(yi)銅箔經熱(re)壓而(er)成的一種敷銅板(ban)(ban)。主要用于高頻(pin)和超高頻(pin)線(xian)路(lu)中作印制板(ban)(ban)用。

（4）覆(fu)銅箔(bo)環氧玻璃布層壓板

是孔金(jin)屬化印制(zhi)板常用的(de)材料(liao)。

（5）軟性聚酯(zhi)敷銅薄膜(mo)

是用聚酯薄膜與銅(tong)熱壓而成(cheng)的帶狀(zhuang)材(cai)料，在應(ying)用中將它(ta)卷(juan)曲(qu)成(cheng)螺旋(xuan)形(xing)狀(zhuang)放(fang)在設備內部。為了加固或防潮，常以環氧樹脂將它(ta)灌(guan)注成(cheng)一個整(zheng)體。主(zhu)要用作柔性印制電路和印制電纜，可作為接插件的過渡線(xian)。目前，市場上供(gong)應(ying)的覆(fu)銅(tong)板(ban)，從基材(cai)考慮，主(zhu)要可分以下幾類：紙基板(ban)、玻纖布基板(ban)、合(he)成(cheng)纖維布基板(ban)、無紡(fang)布基板(ban)、復(fu)合(he)基板(ban)。

覆銅板常用制作材料有哪些

FR-1──酚(fen)醛棉紙，這基材(cai)通(tong)稱電木板（比(bi)FR-2較(jiao)高經濟性）

FR-2──酚醛棉紙(zhi)

FR-3──棉紙（Cotton paper）、環氧樹脂

FR-4──玻璃布（Woven glass）、環氧(yang)樹(shu)脂(zhi)

FR-5──玻璃布(bu)、環氧樹脂

FR-6──毛面玻璃(li)、聚酯(zhi)

G-10──玻璃布、環氧樹(shu)脂

CEM-1──棉紙、環氧樹脂（阻燃）

CEM-2──棉紙、環(huan)氧樹脂（非阻燃）

CEM-3──玻(bo)璃(li)布、環(huan)氧樹脂

CEM-4──玻璃布、環(huan)氧(yang)樹脂

CEM-5──玻(bo)璃(li)布、多(duo)元(yuan)酯

AIN──氮(dan)化鋁

SIC──碳化(hua)硅(gui)